MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit

MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit — Price Analysis

As of Jul 4, 2026, MTK Huawei Max Snapdragon IC Reballing Sheet BGA Stencils for Android Directly Heated Mediatek Snapdragon Hisilicon MTK Spreadtrum Chips BGA Reballing Stencils Kit is listed at ৳199 on Daraz in Bangladesh. That is 20% below its ৳250 list price. DamKoi has tracked this listing for 39 days. Price has held steady at ৳199 across 39+ days of tracking — the listed price is genuine, with no inflated "discount".